MP2488 Просмотр технического описания (PDF) - Monolithic Power Systems

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MP2488

200kHz, 55V Input, 2A High Power LED Driver

Monolithic Power Systems 

MP2488 – 2A, 200kHz, 55V HIGH-POWER LEDS DRIVER

Part Number

MP2488DQ*

MP2488DN**

ORDERING INFORMATION

Package

QFN10(3x3mm)

SOIC8E

Top Marking

7G

MP2488DN

Free Air Temperature (TA)

–40C to +85C

–40C to +85C

*For Tape & Reel, add suffix –Z (eg. MP2488DQ–Z);

For RoHS compliant packaging, add suffix –LF (eg. MP2488DQ–LF–Z)

**For Tape & Reel, add suffix –Z (eg. MP2488 DN–Z);

For RoHS compliant packaging, add suffix –LF (eg. MP2488 DN–LF–Z)

PACKAGE REFERENCE

TOP VIEW

TOP VIEW

SW 1

SW 2

EN 3

COMP 4

FB 5

EXPOSED PAD

10 BST

9 VIN

8 VIN

7 FREQ

6 GND

SW 1

EN 2

COMP 3

FB 4

EXPOSED PAD

8 BST

7 VIN

6 FREQ

5 GND

QFN10(3x3mm)

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage (VIN).....................–0.3V to +60V

Switch Voltage (VSW)............ –0.5V to VIN + 0.5V

BST to SW .....................................–0.3V to +5V

All Other Pins .................................–0.3V to +5V

Junction Temperature ...............................150C

Lead Temperature ....................................260C

Storage Temperature.............. –65°C to +150C

Continuous

Power

Dissipation

(TA=+25C )(2)

QFN10(3x3mm) ......................................... 2.5W

SOIC8 (Exposed Pad) ............................... 2.5W

Recommended Operating Conditions (3)

Supply Voltage VIN ........................... 4.5V to 55V

Maximum Junction Temp. (TJ) ............... +125C

SOIC8E

Thermal Resistance (4) θJA θJC

QFN10(3x3mm)...................... 50 ...... 12... C/W

SOIC8 (Exposed Pad) ............ 50 ...... 10... C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7 4-layer board.

MP2488 Rev. 1.0

www.MonolithicPower.com

2

6/20/2011

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

© 2011 MPS. All Rights Reserved.

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