AM29LV800BT-90DTC2 Просмотр технического описания (PDF) - Advanced Micro Devices
Номер в каталоге
Компоненты Описание
производитель
AM29LV800BT-90DTC2
Advanced Micro Devices
AM29LV800BT-90DTC2 Datasheet PDF : 11 Pages
| |||
SUPPLEMENT
REVISION SUMMARY
Revision A (March 1997)
Initial release.
Revision B (January 1998)
Formatted to match current template. Updated Distinc-
tive Characteristics and General Description sections
using the current main data sheet. Updated for CS39
process technology.
Revision B+1 (March 1998)
Distinctive Characteristics
Changed read and program/erase current to match
data sheet.
Pad Description
Corrected signal names for pads 13–44. Replaced
values for all pad coordinates.
Revision C (November 1998)
Die Photograph, Pad Description, Ordering
Information, Physical Specifications,
Manufacturing Information
Updated for CS39S process technology.
Ordering Information
Changed waffle pack quantity to 140. Changed valid
combinations to reflect die revision 2.
Terms and Conditions
Replaced warranty with new version.
Revision D (December 1998)
Packaging Information
Added section. Moved orientation information from die
photograph into this section.
Revision D+1 (June 14, 1999)
Physical Specifications
Corrected the bond pad dimensions. Deleted Si from
the bond pad metalization specification.
Revision D+2 (July 2, 1999)
Ordering Information
The quantities for each packaging type is now listed.
Contacting AMD for this information is no longer
required.
Revision E (March 12, 2002)
Global
Added 80 ns speed.
Pad Description
Added table of pad locations relative to die center.
Manufacturing Information
Changed test facility to Penang, Malaysia (ACN2016).
Trademarks
Copyright © 2002 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
Am29LV800B Known Good Die
11
Share Link: