8 Wake On Motion (WoM) .............................................................................................. 42
8.1 Wake on Motion Introduction ..........................................................................................42
8.2 Accelerometer Configuration ...........................................................................................42
8.3 Wake on Motion Event ....................................................................................................42
8.4 Configuration Procedure ..................................................................................................42
8.5 Wake on Motion Control Registers ...................................................................................43
8.6 Exiting Wake on Motion Mode .........................................................................................43
9 Performing Device Self Test.......................................................................................... 44
9.1 Accelerometer Self Test ...................................................................................................44
9.2 Gyroscope Self Test..........................................................................................................44
10 Magnetometer Setup ................................................................................................... 45
10.1 Magnetometer Description ..............................................................................................45
10.2 Magnetometer Calibration ...............................................................................................45
11 Host Serial Interface..................................................................................................... 46
11.1 Serial Peripheral Interface (SPI) ........................................................................................46
11.1.1 SPI Timing Characteristics ................................................................................................. 49
11.2 I2C Interface.....................................................................................................................50
12 Package and Handling .................................................................................................. 52
12.1 Package Drawing .............................................................................................................52
12.2 Reflow Specification.........................................................................................................53
12.3 Storage Specifications ......................................................................................................53
13 Related Resources........................................................................................................ 53
14 Document Information................................................................................................. 54
14.1 Revision History...............................................................................................................54
© 2015 Fairchild Semiconductor Corporation
FIS1100 • Rev. 1.2
3
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