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MAX14529E Просмотр технического описания (PDF) - Maxim Integrated

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MAX14529E Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Overvoltage Protection with USB Charger
Detection, LDO, and ESD Protection on D+/D-
Device Operation
The MAX14529E/MAX14530E have an internal oscillator
and charge pump that control the turn-on of the internal
FET switch. The internal oscillator controls the timers
that enable the turn-on of the charge pump and con-
trols the state of the open-drain VOK output. If VIN >
VOVLO, the internal oscillator remains off, thus disabling
the charge pump. If 2.2V < VIN < VOVLO, the internal
charge pump is enabled. The charge-pump turns on
the internal FET switch and asserts VOK. At any time, if
VIN drops below 2.2V or rises above VOVLO, VOK goes
high and the charge pump is disabled, disconnecting
OUT from IN.
Overvoltage Lockout (OVLO)
The MAX14529E has a 5.75V (typ) overvoltage
threshold (OVLO), while the MAX14530E has a 6.8V
(typ) OVLO.
Low Dropout
The low-dropout regulator (LOUT) is powered from
input voltage and supplies 3.3V (typ) to the USB trans-
ceiver. If a lithium-ion (Li+) battery is used to power the
USB transceiver, a boost converter is needed. The LDO
features a minimum 100mA current capability and low
output noise. Drive LEN high to disable the LDO.
Charger Detection
The charger detection detects if there is a short
between the USB D+ and D- data lines. If the data lines
are shorted together and a dedicated charger is
attached, the phone draws more than 500mA to charge
the battery; CDET asserts low. If the data lines are not
biased properly, then an unidentified device is present
and the phone draws no more than 500mA or does not
charge at all, depending on its USB compliance level.
Thermal-Shutdown Protection
The MAX14529E/MAX14530E feature thermal-
shutdown circuitry. The internal switch turns off when
the junction temperature exceeds +150°C (typ) and
immediately goes into a fault mode. The device exits
thermal shutdown after the junction temperature cools
by 20°C (typ).
Applications Information
IN Bypass Capacitor
Bypass IN to GND with a 1µF ceramic capacitor as
close as possible to the device for ±15kV HBM ESD
protection on IN. No capacitor required to obtain ±2kV
HBM protection. If the power source has significant
inductance due to long lead length, take care to
prevent overshoots due to the LC tank circuit and pro-
vide protection.
ESD Test Conditions
ESD performance depends on a number of conditions.
The MAX14529E/MAX14530E are specified for
±15kV HBM typical ESD protection on the D+, D-, and
IN pins when IN is bypassed to ground with a 1µF
ceramic capacitor.
Human Body Model
Figure 2 shows the Human Body Model, and Figure 3
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
est that is then discharged into the device through a
1.5kΩ resistor.
RC
1MΩ
RD
1500Ω
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
HIGH-
VOLTAGE
DC
SOURCE
Cs
100pF
STORAGE
CAPACITOR
DEVICE
UNDER
TEST
Figure 2. Human Body ESD Test Model
IP 100%
90%
AMPERES
36.8%
10%
0
0 tRL
IR
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
TIME
tDL
CURRENT WAVEFORM
Figure 3. Human Body Current Waveform
_______________________________________________________________________________________ 7

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