C0402C820G3GACTU Просмотр технического описания (PDF) - Unspecified
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C0402C820G3GACTU Datasheet PDF : 20 Pages
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G Dielectric, 10 – 250 VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Profile Feature
Termination Finish
SnPb
100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
Ramp-Up Rate (TL to TP)
100°C
150°C
60 – 120 seconds
3°C/second
maximum
150°C
200°C
60 – 120 seconds
3°C/second
maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
Ramp-Down Rate (TP to TL)
20 seconds
maximum
6°C/second
maximum
30 seconds
maximum
6°C/second
maximum
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
TP Maximum Ramp Up Rate = 3ºC/sec
tP
Maximum Ramp Down Rate = 6ºC/sec
TL
tL
Tsmax
Tsmin
ts
25
25ºC to Peak
Time
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1003_C0G • 7/21/2016 11
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