CPF1210D360KE1 Просмотр технического описания (PDF) - TE Connectivity
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производитель
CPF1210D360KE1 Datasheet PDF : 9 Pages
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Thin Film Precision Resistors
Reflow Solder Profile
Reel dimension (mm)
Time of Reflow soldering at maximum temperature point 260°C = 10s
Wave Solder Profile
Qty / Reel
2000
A ±0.5 B ±0.5 C ±0.5 D ±1
2
13.5
21
60
M ±2 W ±1
178 13.8
Handling Recommendations
When flow soldering - the land width must be smaller than the Chip Resistor
width to properly control the solder application. Generally, the land width
can be Chip Resistor width (W) x 0.7 to 0.8. When reflow soldering – solder
application amount can be adjusted. Thus the land width can be set to W x
1.0 to 1.3.
How To Order
How To Order
Time of Wave soldering at maximum temperature point 260°C = 10s
Time of 3So5l2d1ering Iron at maximu1mK0temperature point 4F10°C = 5s T
Common Part Resistance Value Tolerance Pack Style
1 ohm 1R0
CPF
Common Part
CPF - precision
thin film chip
resistor
0603 B
Package Size Tolerance
0201 1206352B1- ±0.1%
0402 1210 D - ±0.5%
0603 2010 F - ±1%
0805 2512
1K1o0h0mR 1000 ohmE s
Value
TCR
100R - 1ΩK0 D – 15PPM
1K0 -
Ω E - 25PPM
10K – 1 ,MeΩg ohCm- 50PPM
1000000 ohms
1M0
1
F – 1% 1P–ac1kKaTgRiEn–EgL2000
J – 5%Blank – stanrdeaerdl reel
0201 0402 - 10K
0603 0805 1206 1210 – 5K
2010 2512 - 4K
1773200 CIS WR 10/2016
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
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