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SI531 Просмотр технического описания (PDF) - Unspecified

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SI531 Datasheet PDF : 12 Pages
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Si530/531
Table 7. Environmental Compliance
The Si530/531 meets the following qualification test requirements.
Parameter
Mechanical Shock
Mechanical Vibration
Solderability
Gross & Fine Leak
Resistance to Solder Heat
Moisture Sensitivity Level
Contact Pads
Conditions/Test Method
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2036
J-STD-020, MSL1
Gold over Nickel
Table 8. Thermal Characteristics
(Typical values TA = 25 ºC, VDD = 3.3 V)
Parameter
Symbol Test Condition Min
Typ
Max Unit
Thermal Resistance Junction to Ambient
JA
Thermal Resistance Junction to Case
JC
Ambient Temperature
TA
Junction Temperature
TJ
Still Air
Still Air
84.6
— °C/W
38.8
— °C/W
–40
85
°C
125
°C
Table 9. Absolute Maximum Ratings1
Parameter
Symbol
Rating
Unit
Maximum Operating Temperature
TAMAX
85
ºC
Supply Voltage, 1.8 V Option
VDD
–0.5 to +1.9
V
Supply Voltage, 2.5/3.3 V Option
VDD
–0.5 to +3.8
V
Input Voltage (any input pin)
VI
–0.5 to VDD + 0.3
V
Storage Temperature
TS
–55 to +125
ºC
ESD Sensitivity (HBM, per JESD22-A114)
ESD
2500
V
Soldering Temperature (Pb-free profile)2
Soldering Temperature Time @ TPEAK (Pb-free profile)2
TPEAK
tP
260
20–40
ºC
seconds
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at
www.silabs.com/VCXO for further information, including soldering profiles.
Rev. 1.5
5

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