SI531 Просмотр технического описания (PDF) - Unspecified

Номер в каталоге

Компоненты Описание

производитель

SI531

CRYSTAL OSCILLATOR (XO) (10 MHZ TO 1.4 GHZ)

Unspecified 

Si530/531

6. 6-Pin PCB Land Pattern

Figure 4 illustrates the 6-pin PCB land pattern for the Si530/531. Table 14 lists the values for the dimensions shown

in the illustration.

Figure 4. Si530/531 PCB Land Pattern

Table 14. PCB Land Pattern Dimensions (mm)

Dimension

(mm)

C1

4.20

E

2.54

X1

1.55

Y1

1.95

Notes:

General

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.

3. This Land Pattern Design is based on the IPC-7351 guidelines.

4. All dimensions shown are at Maximum Material Condition (MMC). Least Material

Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.

Solder Mask Design

1. All metal pads are to be non-solder mask defined (NSMD). Clearance between

the solder mask and the metal pad is to be 60 µm minimum, all the way around

the pad.

Stencil Design

1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls

should be used to assure good solder paste release.

2. The stencil thickness should be 0.125 mm (5 mils).

3. The ratio of stencil aperture to land pad size should be 1:1.

Card Assembly

1. A No-Clean, Type-3 solder paste is recommended.

2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020

specification for Small Body Components.

10

Rev. 1.5

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