CHP2010L17R0JBT Просмотр технического описания (PDF) - Vishay Semiconductors
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Компоненты Описание
производитель
CHP2010L17R0JBT
Vishay Semiconductors
CHP2010L17R0JBT Datasheet PDF : 10 Pages
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www.vishay.com
MECHANICAL SPECIFICATIONS
Substrate
Alumina
Technology
Thick film (ruthenium oxide)
Protection
0.5 < R < 100 M: epoxy coating
R 0.5 : overglaze protection
(no epoxy coating)
Terminations
B (W/A):
SnPb over nickel barrier
for solder reflow
N (W/A):
SnAg over nickel barrier
for solder reflow
F (Flip Chip):
SnAg over nickel barrier
for solder reflow
W (one face) and G (W/A) type:
gold over nickel barrier
for other applications
Note
• Refer to Application Note “Guidelines for Vishay
Sfernice Resistive and Inductive Components”
(www.vishay.com/doc?52029) for recommended reflow profile.
Profile #3 applies
CLIMATIC SPECIFICATIONS
Operating temperature
range
-55 °C; +155 °C
Note
• For temperature up to 215 °C please consult Vishay Sfernice
BEST TOL. AND TCR VS. OHMIC VALUE (1)
OHMIC VALUE
RANGE in
TIGHTEST
TOLERANCE
(%)
BEST
TCR
(ppm/°C)
10 < R < 5M
0.5 % (D)
100 (K)
5 < R < 10M
1 % (F)
100 (K)
1 < R < Rmax.
0.1 < R < Rmax.
2 % (G)
5 % (J)
200 (L)
200 (L)
Note
(1) Improved performance on request
CHIPS FOR HIGH FREQUENCY APPLICATIONS
The HF performance of flip chip and W/A types can be
improved on request.
Please ask for HCHP
CHP, HCHP
Vishay Sfernice
POWER DERATING CURVE
100
80
60
40
20
0
0 20 40 60 70 80 100 120 140 155
Ambient Temperature in °C
PACKAGING
ESD packaging available: Waffle pack and plastic tape and
reel (low conductivity). Paper tapes available on request
(ESD only).
SIZE
0502
0505
0603
0805
1005
1206
1505
2010
1010
2208
1020
2512
MOQ
NUMBER OF PIECES PER
WAFFLE
PACK
TAPE AND
MIN. MAX.
400
4000
100
5000
221
4000
100
140
100
60
2000
100
2500
60
4000
60
1000
50
2000
TAPE
WIDTH
8 mm
8 mm
8 mm
8 mm
8 mm
8 mm
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code
Tape and Reel
See Part Numbering information to get the quantity desired
by tape.
Revision: 24-Jan-18
3
Document Number: 52023
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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