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301K Datasheet PDF : 7 Pages
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Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
465 AND 476 SERIES High-Power Heat Sinks for Medium Hex-Type Rectifiers and Diodes
Stud-Mount
Standard
P/N
Nominal Dimensions
Width
Length
in. (mm)
in. (mm)
Height
in. (mm)
465K
476K
476W
4.000 (101.6)
5.000 (127.0)
5.000 (127.0)
5.000 (127.0)
6.000 (152.4)
6.000 (152.4)
4.000 (101.6)
5.000 (127.0)
5.000 (127.0)
Hex Style
Type
1.060 in. Hex
1.250 in. Hex
1.250 in. Hex
Mounting
Hole Pattern
None
None
0.765 in.
(19.4)Dia.
Center Mount
Thermal Performance at Typical Load
Natural Convection Forced Convection
38°C @ 5OW
25°C @ 5OW
25°C @ 5OW
0.27°C/W @500 LFM
0.19°C/W @500 LFM
0.19°C/W @500 LFM
Weight
lbs. (grams)
1.9300 (875.45)
2.8200(1279.15)
2.8000(1270.08)
Wakefield Engineering has designed four standard heat sink types for ease of installation and
efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount
power devices: 465, 476, 486, and 489 Series. The 465 and 476 Series shown here are
designed for 1.060 in. Hex (465 Type) and 1.250 in. Hex (476 Type). The 476W Type is avail-
able predrilled for an 0.765 in. (19.4) dia, mounting hole, Material: Aluminum Alloy, Black
anodized.
MECHANICAL DIMENSIONS
476 SERIES (EXTRUSION
PROFILE 1245)
K
SEMICONDUCTOR
MOUNTING HOLES
465 SERIES (EXTRUSION
PROFILE 1244)
W
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
486 AND 489 SERIES Heat Sinks for High-Power Hex-Type Rectifiers and Diodes
Stud-Mount
Standard
P/N
486K ̆
Nominal Dimensions
Width
Length
Height
in. (mm)
in. (mm)
in. (mm)
6.250 (158.8) 6.000 (152.4) 6.250 (158.8)
489K ̆ 6.250 (158.8) 9.000 (228.6) 6.250 (158.8)
Hex Style
Type
1.750 in. Hex
1.750 in. Hex
Mounting
Hole Pattern
None
None
Thermal Performance at Typical Load
Natural Convection Forced Convection
24° C @ 50W
86° C @ 250W
19° C @ 50W
75° C @ 250W
0.20° C/W @250 LFM
0.13° C/W @500 LFM
0.15° C/W @250 LFM
0.10° C/W @500 LFM
Weight
lbs. (grams)
4.2100 (1909.66)
6.1400 (2785.10)
These two heat sink types accept industry standard 1.750 in. (44.5) hex-type devices for
mounting and efficient heat dissipation. Each type is provided with a 1.750 in. (44.5) x 2.000
in. (50.8) area on the semiconductor base mounting surface which is free of anodize.
Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
SEMICONDUCTOR
MOUNTING HOLE
K
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
̆ Normally stocked
SERIES
486
489
486 AND 489 SERIES
(EXTRUSION
PROFILE 1541)
53
All other products, please contact factory for price, delivery, and minimums.
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