SUCS60512C Просмотр технического описания (PDF) - Unspecified
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SUCS60512C Datasheet PDF : 8 Pages
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SUCS3
GENERAL SPECIFICATIONS
INPUT-OUTPUT
AC500V 1minute, Cutoff current = 10mA, DC500V 50MW min (20t15C)
ISOLATION INPUT-CASE
AC500V 1minute, Cutoff current = 10mA, DC500V 50MW min (20t15C)
OUTPUT-CASE
AC500V 1minute, Cutoff current = 10mA, DC500V 50MW min (20t15C)
OPERATING TEMP.,HUMID.AND ALTITUDE -40 to +85C, 20 - 95%RH (Non condensing) (Required Derating), 3,000m (10,000feet) max
STORAGE TEMP.,HUMID.AND ALTITUDE
ENVIRONMENT
VIBRATION
-40 to +100C, 20 - 95%RH (Non condensing), 9,000m (30,000feet) max
10 - 55Hz, 98.0m/s2 (10G), 3minutes period, 60minutes each along X, Y and Z axis
IMPACT
490.3m/s2 (50G), 11ms, once each along X, Y and Z axis
SAFETY AGENCY APPROVALS UL60950-1, C-UL, EN60950-1
CASE SIZE/WEIGHT
OTHERS
COOLING METHOD
25X7.0X16.1mm [0.98X0.28X0.63 inches] (WXHXD) / 5g max
Convection/Forced air
*1 SUCW3xx12/SUCW3xx15 is available as single output, +24V/+30V.
*2 Rated input 5V, 12V, 24V or 48V DC Io=100%
*3 Ripple and Ripple Noise is measured by using measuring board with capacitor with in 25mm from output pin terminals.
*4 Drift is the change in DC output for an eight hour period after a half-hour warm-up at 25C.
* Parallel operation with other model is not possible.
External view
1.SMD(type B)
+Vin
RC
-Vin
Pin terminal part details
1.8±0.3
[0.07]
Coplanarity within 0.1
[0.004]
2.DIP(type C)
+Vin
RC
-Vin
3.68±0.25
[0.14]
7
[0.28]
Adsorption area
Model
+Vout Component area
Recommended Pad and Hole dia.
(TOP VIEW)
type B
25
[0.98]
1
1.27 [0.04]
[0.05] 26.16 ±0.6
[1.03]
Model
25
[0.98]
TRM
-Vout
Part A
0.1min
[0.004]
Closeup of part A
3.2
[0.13]
type C
2
[0.08]
27.76
[1.09]
3.2
[0.13]
º1.6
6-º0.9 [0.06]
[0.04]
Unit : 0.1inch
Dimensions in mm, [ ]=inches
Component area
+Vout
TRM
-Vout
Part A
0.1min
[0.004]
Closeup of part A
¶ Tolerance ±0.5 [±0.02]
¶ Dimensions in mm, [ ]=inches
SU.SUC/SUT
¶ Pin terminal thickness : 0.3±0.1 [0.012]
¶ Pin terminal material : Copper alloy
¶ Plating treatment of terminal : Lead free plating
¶ Case thickness : 0.2±0.05 [0.008]
¶ Case material : Brass
¶ Plating treatment of case : Nickel plating
¶ Please keep enough creepage
distance with the pattern on PCB
and other components.
¶ Weight : 5g max
1
1.27 [0.04]
[0.05]22.86
[0.9]
SU.SUC/SUT-21
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