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MCF5272VF66J Просмотр технического описания (PDF) - Freescale Semiconductor

Номер в каталоге
Компоненты Описание
производитель
MCF5272VF66J
Freescale
Freescale Semiconductor Freescale
MCF5272VF66J Datasheet PDF : 544 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
Table of Contents (Continued)
Paragraph
Number
Title
Page
Number
5.4.5 Data Breakpoint/Mask Registers (DBR, DBMR) ............................................................ 5-12
5.4.6 Program Counter Breakpoint/Mask Registers
(PBR, PBMR) ............................................................................................................................ 5-13
5.4.7 Trigger Definition Register (TDR) ................................................................................... 5-14
5.5 Background Debug Mode (BDM) ............................................................................................... 5-15
5.5.1 CPU Halt .......................................................................................................................... 5-16
5.5.2 BDM Serial Interface ....................................................................................................... 5-17
5.5.2.1 Receive Packet Format ....................................................................................... 5-18
5.5.2.2 Transmit Packet Format ...................................................................................... 5-18
5.5.3 BDM Command Set ......................................................................................................... 5-19
5.5.3.1 ColdFire BDM Command Format ...................................................................... 5-20
5.5.3.1.1 Extension Words as Required .................................................................... 5-20
5.5.3.2 Command Sequence Diagrams ........................................................................... 5-21
5.5.3.3 Command Set Descriptions ................................................................................ 5-22
5.5.3.3.1 Read A/D Register (RAREG/RDREG)........................................................... 5-22
5.5.3.3.2 Write A/D Register (WAREG/WDREG) ........................................................ 5-23
5.5.3.3.3 Read Memory Location (READ) ................................................................. 5-24
5.5.3.3.4 Write Memory Location (WRITE)............................................................... 5-25
5.5.3.3.5 Dump Memory Block (DUMP) ................................................................... 5-27
5.5.3.3.6 Fill Memory Block (FILL) .......................................................................... 5-28
5.5.3.3.7 Resume Execution (GO) ............................................................................. 5-29
5.5.3.3.8 No Operation (NOP).................................................................................... 5-30
5.5.3.3.9 Read Control Register (RCREG).................................................................. 5-30
5.5.3.3.10 Write Control Register (WCREG).............................................................. 5-31
5.5.3.3.11 Read Debug Module Register (RDMREG)................................................. 5-32
5.5.3.3.12 Write Debug Module Register (WDMREG)............................................... 5-33
5.6 Real-Time Debug Support ........................................................................................................... 5-33
5.6.1 Theory of Operation .......................................................................................................... 5-34
5.6.1.1 Emulator Mode ................................................................................................... 5-35
5.6.2 Concurrent BDM and Processor Operation ...................................................................... 5-35
5.7 Processor Status, DDATA Definition ........................................................................................... 5-36
5.7.1 User Instruction Set .......................................................................................................... 5-36
5.7.2 Supervisor Instruction Set ................................................................................................ 5-40
5.8 Freescale-Recommended BDM Pinout ....................................................................................... 5-41
Chapter 6
System Integration Module (SIM)
6.1 Features .......................................................................................................................................... 6-1
6.2 Programming Model ...................................................................................................................... 6-2
6.2.1 SIM Register Memory Map ................................................................................................ 6-2
6.2.2 Module Base Address Register (MBAR) ........................................................................... 6-3
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
xvi
Freescale Semiconductor

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