DF8064101211300SR0VY Просмотр технического описания (PDF) - Intel
Номер в каталоге
Компоненты Описание
производитель
DF8064101211300SR0VY Datasheet PDF : 122 Pages
| |||
4.3 Processor Clocking .............................................................................................49
4.3.1 PLL Power Supply ...................................................................................49
4.4 Voltage Identification (VID).................................................................................50
4.5 Catastrophic Thermal Protection ..........................................................................56
4.6 Reserved or Unused Signals ................................................................................56
4.7 Signal Groups ...................................................................................................57
4.8 Test Access Port (TAP) Connection .......................................................................57
4.9 DC Specifications ...............................................................................................57
4.9.1 Flexible Motherboard Guidelines (FMB) ......................................................57
4.9.2 Voltage and Current Specifications ............................................................58
4.9.3 DC Specifications ....................................................................................64
5
Mechanical Specifications and Ball Information .......................................................74
5.1 Mechanical Specifications ...................................................................................74
5.1.1 Mechanical Drawings ..............................................................................74
5.1.2 Loading Specifications ............................................................................75
5.2 Processor Ballout Assignment ..............................................................................75
6
Signal Quality Specifications ....................................................................................94
6.1 Signal Quality Specifications and Measurement Guidelines.......................................94
6.1.1 Overshoot/Undershoot Guidelines .............................................................94
6.1.2 Overshoot/Undershoot Magnitude .............................................................95
6.1.3 Overshoot/Undershoot Pulse Duration .......................................................95
7
Power Management .................................................................................................97
7.1 ACPI state Supported .........................................................................................97
7.1.1 System States........................................................................................97
7.1.2 Processor Idle States...............................................................................97
7.1.3 Integrated Graphics Display States ...........................................................98
7.1.4 Integrated Memory Controller States .........................................................98
7.1.5 DMI States ............................................................................................98
7.1.6 Interface State Combinations ...................................................................99
7.2 Processor Core Power Management ......................................................................99
7.2.1 Enhanced Intel SpeedStep® Technology .................................................. 100
7.2.2 Dynamic Cache Sizing ........................................................................... 100
7.2.3 Low-Power Idle States........................................................................... 101
7.2.4 Graphics Power Management.................................................................. 103
7.2.5 Thread C-state Description..................................................................... 105
7.2.6 Processor Core/ C-states Description ....................................................... 106
7.2.7 Package C-States ................................................................................. 107
7.3 IMC Power Management ................................................................................... 110
7.3.1 Disabling Unused System Memory Outputs............................................... 110
7.3.2 DRAM Power Management and Initialization ............................................. 111
7.4 DMI Power Management ................................................................................... 112
7.4.1 Stop-Grant State .................................................................................. 112
7.4.2 Stop-Grant Snoop State ........................................................................ 113
7.4.3 Deep Sleep State.................................................................................. 113
7.4.4 Deeper Sleep State ............................................................................... 113
7.4.5 Extended Low-Power States ................................................................... 113
8
Thermal Specifications and Design Considerations................................................. 115
8.1 Thermal Specifications...................................................................................... 115
8.1.1 Intel® Thermal Monitor ......................................................................... 116
8.1.2 Digital Thermal Sensor .......................................................................... 118
8.1.3 Out of Specification Detection................................................................. 119
4
Datasheet - Volume 1 of 2
Share Link: 