C1206H104J3GACTU Просмотр технического описания (PDF) - Unspecified

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Компоненты Описание

производитель

C1206H104J3GACTU

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Unspecified 

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)

Table 2B – Bulk Packaging Quantities

Packaging Type

Packaging C-Spec1

Loose Packaging

Bulk Bag (default)

N/A2

Secure Packaging

2” x 2” Waffle Pack/

Tray3

7282/7292

Case Size

Chip Thickness Packaging Quantities (pieces/unit packaging)

EIA (in) Metric (mm)

(mm)

Minimum Maximum Minimum Maximum

0402

1005

368

0603

1608

All

368

0805

2012

100

50,000

1206

3216

≤ 1.25 (nominal)

126

1206

3216

> 1.25 (nominal)

50

1210

3225

1

1

80

1808

4520

50

1812

4532

All

1825

4564

42

20,000

20

2220

5650

20

2225

5664

20

1 The "Packaging C-Spec" is a 4-digit code which identifies the packaging type. When ordering, the proper code must be included in the 15th through

18th character positions of the ordering code. See "Ordering Information" section of this document for further details. Product ordered without a

packaging C-Spec will default to our standard "Bulk Bag" packaging.

2 A packaging C-Spec (see note 1 above) is not required For "Bulk Bag" packaging (excluding Anti-Static Bulk Bag). The 15th through 18th character

positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging.

3 Also commonly referred to as “Chip Carrier” or “Molded Tray”. All tray packaging options offer static protection.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

C1001_C0G_200C_SMD • 7/29/2016 10

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