DSS1NB32A471Q91A Просмотр технического описания (PDF) - Unspecified
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DSS1NB32A471Q91A Datasheet PDF : 10 Pages
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Spec No. JENF243F-0031-01
Reference Only P8/9
△ 13. ! Caution
13.1 Mounting holes
Mounting holes should be designed as specified in this specifications.
Or different design from this specifications may cause cracks in ceramics which may lead to smoking / firing.
13.2 Caution for the product angle adjust work
Take care not to apply any mechanical stress to product body at the lead terminal bending process for product
angle adjustment after insertion.
13.3 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment
(7) Traffic signal equipment
(2) Aerospace equipment
(7) Disaster prevention / crime prevention equipment
(3) Undersea equipment
(9) Data-processing equipment
(4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment
to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
14. Notice
14.1 Soldering
(1) Use rosin-based flux. Do not use strong acidic flux with halide content exceeding 0.2(wt)%
(chlorine conversion value).
Use Sn-3.0Ag-0.5Cu solder
(2) Standard flow soldering profile.
300
Pre- heating(in air)
Soldering
Gradual Cooling
(in air)
Solder temp.
250
200
150
100
50
Solder
temperature
250～260 °C
Soldering
time
4～6s
1 minutes min. Soldering time
(3) Resistance to soldering iron goes in the following condition that tip temperature is 350 °C max. And
soldering time is 5 s max.
(4) Products and the leads should not be subjected to any mechanical stress during soldering process.
(and also while subjected to the equivalent high temperature.)
MURATA MFG.CO., LTD
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