MAL216099503E3 Просмотр технического описания (PDF) - Vishay Semiconductors
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MAL216099503E3 Datasheet PDF : 10 Pages
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www.vishay.com
160 CLA
Vishay BCcomponents
Table 2
TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES
NOMINAL
CASE SIZE
LxWxH
CASE
CODE
PITCH
P1
TAPE WIDTH
W
TAPE
THICKNESS
T2
REEL DIAMETER
12.5 x 12.5 x 13
1213
20
24
16.2
380
12.5 x 12.5 x 16
1216
24
32
18.5
380
16 x 16 x 16
1616
28
44
18.9
380
16 x 16 x 21
1621
28
44
23.4
380
18 x 18 x 16
1816
32
44
18.9
380
18 x 18 x 21
1821
32
44
Note
• Detailed tape dimensions see section “PACKAGING”
23.4
380
PACKAGING
QUANTITY
PER REEL
250
200
150
100
125
100
MOUNTING
The capacitors are designed for automatic placement on to
printed-circuit boards.
Optimum dimensions of soldering pads depend amongst
others on soldering method, mounting accuracy, print
layout and/or adjacent components.
For recommended soldering pad dimensions, refer to Fig. 3
and Table 3.
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time, where the temperature is that measured on the
component during processing.
For maximum conditions refer to Fig. 4.
Any temperature versus time curve which does not exceed
the specified maximum curves may be applied.
As a general principle, temperature and duration shall be the
minimum necessary required to ensure good soldering
connections. However, the specified maximum curves
should never be exceeded.
e
d
a
c
a
b
f
d
a
c
a
Case size Ø D = 12.5 mm
b
Case size Ø D ≥ 16 mm
Fig. 3 - Recommended soldering pad dimensions
Table 3
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters
CASE CODE
a
b
c
d
e
f
1213
6.3
2.5
4.0
4.2
5.0
5.6
1216
6.3
2.5
4.0
4.2
5.0
5.6
1616
7.8
9.6
4.7
-
-
-
1621
7.8
9.6
4.7
-
-
-
1816
8.8
9.6
4.7
-
-
-
1821
8.8
9.6
4.7
-
-
-
Revision: 04-Dec-12
3
Document Number: 28405
For technical questions, contact: aluminumcaps1@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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