MAL214699509E3(2013) Просмотр технического описания (PDF) - Vishay Semiconductors

Номер в каталоге

Компоненты Описание

производитель

MAL214699509E3
(Rev.:2013)

Aluminum Capacitors SMD (Chip), High Temperature, Low Impedance

Vishay Semiconductors 

www.vishay.com

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print

layout and/or adjacent components.

For recommended soldering pad dimensions, refer to Fig. 3

and Table 3.

146 CTI

Vishay BCcomponents

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

component during processing.

For maximum conditions refer to Fig. 4.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

As a general principle, temperature and duration shall be the

minimum necessary required to ensure good soldering

connections. However, the specified maximum curves

should never be exceeded.

b

a

c

a

Case size Ø D ≤ 10 mm

e

d

b

f

d

a

c

a

Case size Ø D = 12.5 mm

Fig. 3 - Recommended soldering pad dimensions

a

c

a

b

Case size Ø D ≥ 16 mm

Table 3

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters

CASE CODE

a

b

c

d

e

f

1010

4.4

2.5

4.0

-

-

-

1012

4.4

2.5

4.0

-

-

-

1213

6.3

2.5

4.0

4.2

5.0

5.6

1216

6.3

2.5

4.0

4.2

5.0

5.6

1616

7.8

9.6

4.7

-

-

-

1621

7.8

9.6

4.7

-

-

-

1816

8.8

9.6

4.7

-

-

-

1821

8.8

9.6

4.7

-

-

-

Revision: 01-Oct-13

4

Document Number: 28403

For technical questions, contact: aluminumcaps1@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Share Link: