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PCA9617ATPZ Просмотр технического описания (PDF) - NXP Semiconductors.

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производитель
PCA9617ATPZ
NXP
NXP Semiconductors. NXP
PCA9617ATPZ Datasheet PDF : 23 Pages
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NXP Semiconductors
PCA9617A
Level translating Fm+ I2C-bus repeater
5. Pinning information
5.1 Pinning
VCC(A) 1
SCLA 2
SDAA 3
GND 4
PCA9617ADP
8 VCC(B)
7 SCLB
6 SDAB
5 EN
002aag643
Fig 2. Pin configuration for TSSOP8
(MSOP8)
terminal 1
index area
SDAA 1
GND 2
EN 3
SDAB 4
PCA9617ATP
8 SCLA
7 VCC(A)
6 VCC(B)
5 SCLB
002aag644
Transparent top view
Fig 3. Pin configuration for HWSON8
5.2 Pin description
Table 3.
Symbol
VCC(A)
SCLA
SDAA
GND
EN
SDAB
SCLB
VCC(B)
Pin description
Pin
TSSOP8
1
2
3
4
5
6
7
8
HWSON8
7
8
1
2[1]
3
4
5
6
Description
port A supply voltage (0.8 V to 5.5 V)
serial clock port A bus
serial data port A bus
supply ground (0 V)
active HIGH repeater enable input
serial data port B bus
serial clock port B bus
port B supply voltage (2.2 V to 5.5 V)
[1] HWSON8 package die supply ground is connected to both GND pin and exposed center pad. GND pin
must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and
board level performance, the exposed pad needs to be soldered to the board using a corresponding
thermal pad on the board and for proper head conduction through the board, thermal vias need to be
incorporated in the printed-circuit board in the thermal pad region.
PCA9617A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 March 2013
© NXP B.V. 2013. All rights reserved.
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