ADM1270ACPZ-R2 Просмотр технического описания (PDF) - Analog Devices
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ADM1270ACPZ-R2 Datasheet PDF : 21 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VCC/SENSE+
VCAP
UV
OV
ISET
FLB
FB_PG
TIMER_OFF
TIMER
FAULT
ENABLE
PWRGD
GATE
GATE to VCC/SENSE+
SENSE−
RPFG
RPFG to VCC/SENSE+
VSENSE (VSENSE+ − VSENSE−)
Continuous Current into Any Pin
Storage Temperature Range
Operating Temperature Range
Lead Temperature, Soldering (10 sec)
Junction Temperature
Rating
−0.3 V to +66 V
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to VCAP + 0.3 V
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to VCAP + 0.3 V
−0.3 V to VCAP + 0.3 V
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +66 V
−0.3 V to VCC + 0.3 V
−22 V to +0.3 V
−0.3 V to VCC + 0.3 V
−0.3 V to VCC + 0.3 V
−22 V to +0.3 V
±0.3 V
±10 mA
−65°C to +150°C
−40°C to +125°C
300°C
150°C
ADM1270
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL CHARACTERISTICS
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
16-Lead, 3 mm × 3 mm LFCSP
16-Lead QSOP
θJA
49.5
106.03
θJC
35.2
28.31
ΨJB
29.6
43.22
Unit
°C/W
°C/W
ESD CAUTION
Rev. A | Page 5 of 21
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