LPC1812JBD144 Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание

производитель

LPC1812JBD144

32-bit ARM Cortex-M3 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC

NXP Semiconductors. 

NXP Semiconductors

LPC185x/3x/2x/1x

32-bit ARM Cortex-M3 microcontroller

4. Ordering information

Table 1. Ordering information

Type number

Package

Name

Description

Version

LPC1857FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC1857JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC1857JBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm

SOT459-1

LPC1853FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC1853JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC1853JBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm

SOT459-1

LPC1837FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC1837JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC1837JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

SOT486-1

LPC1837JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC1833FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC1833JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC1833JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

SOT486-1

LPC1833JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC1827JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

SOT486-1

LPC1827JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC1825JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

SOT486-1

LPC1825JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC1823JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

SOT486-1

LPC1823JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC1822JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

SOT486-1

LPC1822JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC1817JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

SOT486-1

LPC1817JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC1815JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

SOT486-1

LPC1815JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC1813JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

SOT486-1

LPC1813JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC1812JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm

SOT486-1

LPC1812JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC185X_3X_2X_1X

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 5.2 — 8 March 2016

© NXP B.V. 2016. All rights reserved.

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