AL8807AMP-13(2012) Просмотр технического описания (PDF) - Diodes Incorporated.

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производитель

AL8807AMP-13
(Rev.:2012)

HIGH EFFICIENCY LOW EMI WIDE ANALOG DIMMING RANGE 36V 1A/1.3A BUCK LED DRIVER

Diodes Incorporated. 

AL8807A

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

VINSU Internal Regulator Start Up Threshold VIN rising

5.9

V

VINSH Internal Regulator Hysteresis Threshold VIN falling

100

300

mV

IQ

Quiescent Current

IS

Input Supply Current

CTRL pin Output not switching (Note 6)

floating f = 250kHz

350

µA

1.8

5

mA

VTH

VTH-H

Set Current Threshold Voltage

Set Threshold Hysteresis

CTRL pin floating

95

100

105

mV

±20

%

VTH-10% 10% Set Current Threshold Voltage

VCTRL = 0.25V

4

10

15

mV

ISET

SET Pin Input Current

VSET = VIN -0.1

16

22

µA

RCTRL CTRL Pin Input Resistance

Referred to internal reference

50

kΩ

VREF Internal Reference Voltage

2.5

V

RDS(on) On Resistance of SW MOSFET

ISW = 0.3A

SOT25

MSOP-8EP

0.25

0.40

Ω

0.18

0.35

tR

SW Rise Time

tF

SW Fall Time

VSENSE = 100 ±20mV, fSW = 250kHz

VSW = 0.1V ~ 12V ~ 0.1V, CL = 15pF

ISW_Leakage Switch Leakage Current

VIN = 36V

TOTP Over-Temperature Shutdown

TOTP-Hyst Over-Temperature Hysteresis

Thermal Resistance Junction-to-Ambient SOT25 (Note 8)

θJA

(Note 7)

MSOP-8EP (Note 9)

12

ns

20

ns

0.5

μA

150

°C

25

°C

250

69

Thermal Resistance Junction-to-Lead

θJL

(Note 10)

SOT25 (Note 8)

50

°C/W

Thermal Resistance Junction-to-case

θJC

(Note 11)

MSOP-8EP (Note 9)

4.3

Notes:

6. AL8807A does not have a low power standby mode but current consumption is reduced when output is not being switched.

7. Refer to Figure 40 for the device derating curve.

8. Test condition for SOT25: Device mounted on FR-4 PCB (25mm x 25mm 1oz copper, minimum recommended pad layout on top layer and thermal

vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.

9. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and

thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed.

10. Dominant conduction path via Gnd pin (pin 2).

11. Dominant conduction path via exposed pad.

AL8807A

Document number: DS35990 Rev. 1 - 2

4 of 20

www.diodes.com

September 2012

© Diodes Incorporated

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