74ABT827 Просмотр технического описания (PDF) - NXP Semiconductors.
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74ABT827 Datasheet PDF : 14 Pages
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NXP Semiconductors
74ABT827
10-bit buffer/line driver; non-inverting; 3-state
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
D
y
Z
24
pin 1 index
1
e
E
A
X
c
HE
vM A
13
12
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT355-1
MO-153
L
Lp
Q
v
w
y
Z (1) θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.5
0.2
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 10. Package outline SOT355-1 (TSSOP24)
74ABT827_3
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 24 February 2010
© NXP B.V. 2010. All rights reserved.
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