BFC246925222 Просмотр технического описания (PDF) - Vishay Semiconductors
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BFC246925222 Datasheet PDF : 15 Pages
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End of Life September 2018 - Alternative Device: MKT467, MKT468
www.vishay.com
MKT469
Vishay BCcomponents
HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY
THICKNESS IN mW/°C
Wmax.
(mm)
PITCH 10 mm
HEAT CONDUCTIVITY (mW/°C)
PITCH 15.5 mm
PITCH 22.5 mm
PITCH 27.5 mm
4.0
4.0
5.0
-
-
4.5
4.5
6.0
-
-
5.0
5.0
6.0
12.0
13.0
5.5
6.0
6.5
13.0
15.0
6.0
6.0
6.5
13.0
15.0
6.5
6.5
8.0
15.0
17.0
7.0
-
8.0
15.0
17.0
7.5
-
9.0
17.0
18.0
8.0
-
9.0
17.0
20.0
8.5
-
11.0
18.0
20.0
9.0
-
11.0
18.0
22.0
9.5
-
12.0
20.0
22.0
10.0
-
12.0
20.0
23.0
10.5
-
-
22.0
25.0
11.0
-
-
-
25.0
11.5
-
-
-
27.0
12.0
-
-
-
27.0
12.5
-
-
-
30.0
13.0
-
-
-
30.0
13.5
-
-
-
30.0
14.0
-
-
-
30.0
14.5
-
-
-
33.0
15.0
-
-
-
33.0
15.5
-
-
-
37.0
16.0
-
-
-
37.0
POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function
of the free ambient temperature.
The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film
Capacitors”.
The component temperature rise (T) can be measured (see section “Measuring the component temperature” for more details)
or calculated by T = P/G:
• T = component temperature rise (°C)
• P = power dissipation of the component (mW)
• G = heat conductivity of the component (mW/°C)
Revision: 27-Mar-18
9
Document Number: 28244
For technical questions, contact: dc-film@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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