TNPW040220K0BEED Просмотр технического описания (PDF) - Vishay Semiconductors

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производитель

TNPW040220K0BEED

High Stability Thin Film Flat Chip Resistors

Vishay Semiconductors 

www.vishay.com

TNPW e3

Vishay

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1 IEC 60068-2 (1)

CLAUSE TEST METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (R)

Stability for product types:

TNPW0402 e3

TNPW0603 e3

TNPW0805 e3

TNPW1206 e3

TNPW1210 e3

Solder bath method;

SnPb40; non-activated flux

(215 ± 3) °C; (3 ± 0.3) s

4.17

58 (Td)

Solderability

Solder bath method;

Good tinning ( 95 % covered);

no visible damage

SnAg3Cu0.5 or SnAg3.5; non-activated

flux

(235 ± 3) °C; (2 ± 0.2) s

4.18

58 (Td)

Resistance to

soldering heat

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

± (0.02 % R + 0.01 )

Component

4.29

45 (XA)

solvent

Isopropyl alcohol + 50 °C; method 2

resistance

No visible damage

4.32

21 (Ue3)

Shear

(adhesion)

TNPW0402 e3 and TNPW0603 e3: 9 N

TNPW0805 e3 and TNPW1206 e3: 45 N

No visible damage

4.33

21 (Ue1)

Substrate

bending

Depth 2 mm, 3 times

± (0.05 % R + 0.01 )

no visible damage,

no open circuit in bent position

4.7

4.35

-

Voltage proof

-

Flammability

URMS = Uins; 60 ± 5 s

IEC 60695-11-5 (1),

needle flame test; 10 s

No flashover or breakdown

No burning after 30 s

Note

(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.

Revision: 12-May-16

11

Document Number: 28758

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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