IMB01CGR Просмотр технического описания (PDF) - TE Connectivity
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IMB01CGR Datasheet PDF : 4 Pages
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24108°0C°C
Dottedline: processlimits
Packing
Dimensions in
130°C
180°C
100°C
forced
cooling
130°C
SignfaorlceRdelays
AXICOM
cooling
100°C
Vapor Phase Soldering: TeAmXIpCeOrMaÊtSuirgen/aTlÊimReelayPsrofile
Time (s)
IM - B Relay (Continued)V(aLpeoardPahnadseHoSuosldinegrinPge:aTkeIATmMIXeMIpmCOeRpMRreaeÊetrlSuaailgrtayneua/yrlTeÊRi)melaeysProfile
Processing Recommended sToimldeer(isn)g conditions
Recommended Reflow Soldering Profile
(Lead and Housing Peak Temperature)
PPaPacakcciknkgiinngg
Soldering conditions according IEC 60058-2-58 and
RecIPoCm/JEmDEeCndJ-eSdTDR-0e2fl0Dow Soldering Profile
Tube for THT version
50 relays per tube, 1000 relays per box
Tube for THT version
50 relays per tube
1,000 relays per box
Time (s)
Time (s)
Resistance to Soldering Heat - Reflow IPnfrraorefid lSeoldering: temperature/
Resistance to soldering heat - Reflow profile
time profile (lead and housing
peak temperature)
Resistance to Soldering Heat - Reflow Profile
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Tape and reel for SMT version
1000 relays per reel, 1000 or 5000 relays per box
Tape and reel for SMT version
1,000 relays per reel
1,000 or 5,000 relays per box
T5u0brTeeulfaboy
1,00500rer
1,00
Reel Dimension
Time (s)
Recommended reflow solderinTgimpero(sfi)le
Reel DInimfraernesdioSnoldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
RIneferladrimeednsSioonlsdering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Reel Dimension
Reel Dimension
Tape an
1,000 re
1,00T0apo
1,00
1,00
All specifications subject to change. Consult Tyco Electronics for latest specifications.
All specifications subject to change. Consult Tyco Electronics for latest specifications.
All specifications subject to change. Consult Tyco Electronics for latest specifications.
25 of 28
25 of 28
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Vapor Phase Soldering:
temperature/time profile (lead
and housing peak temperature)
All specifications subject to change. Consult Tyco Electronics for latest specifications.
All specifications subject to change. Consult Tyco Electronics for latest specifications.
01-2016, Rev. 0116
www.te.com
© 2015 Tyco Electronics Corporation,
a TE Connectivity Ltd. company
Datasheets and product specification
according to IEC 61810-1 and to be used
only together with the ‘Definitions’ section.
3
Datasheets and product data is subject to the Datasheets, product data, ‘Definitions’ sec-
terms of the disclaimer and all chapters of
tion, application notes and all specifications
the ‘Definitions’ section, available at
are subject to change.
http://relays.te.com/definitions
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