MRFIC1502 Просмотр технического описания (PDF) - Motorola => Freescale
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MRFIC1502 Datasheet PDF : 7 Pages
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PACKAGE DIMENSIONS
4X
0.200 (0.008) AB T–U Z
9
A
A1
48
37
DETAIL Y
P
1
–T–
36
–U–
B
B1
12
V
AE
V1
25
13
24
–Z–
S1
S
4X
0.200 (0.008) AC T–U Z
–T–, –U–, –Z–
DETAIL Y
–AB–
–AC–
G
AD
ÇÇÇÉÉÉÇÇÇÉÉÉBAÇÇÇÉÉÉSEMÇÇÇETALN J
F
D
0.080 (0.003) M AC T–U S Z S
SECTION AE–AE
0.080 (0.003) AC
M_
TOP & BOTTOM
CE
H
W
DETAIL AD
CASE 932–02
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
AE
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 7.000 BSC
0.276 BSC
A1 3.500 BSC
0.138 BSC
B 7.000 BSC
0.276 BSC
B1 3.500 BSC
0.138 BSC
C 1.400 1.600 0.055 0.063
D 0.170 0.270 0.007 0.011
E 1.350 1.450 0.053 0.057
F 0.170 0.230 0.007 0.009
G 0.500 BASIC 0.020 BASIC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.500 0.700 0.020 0.028
M
12 _REF
12 _REF
N 0.090 0.160 0.004 0.006
P 0.250 BASIC 0.010 BASIC
Q 1_ 5_ 1_ 5_
R 0.150 0.250 0.006 0.010
S 9.000 BSC
0.354 BSC
S1 4.500 BSC
0.177 BSC
V 9.000 BSC
0.354 BSC
V1 4.500 BSC
0.177 BSC
W 0.200 REF
0.008 REF
X 1.000 REF
0.039 REF
R
GAUGE PLANE
0.250 (0.010)
Q_
K
X
MRFIC1502
6
MOTOROLA RF DEVICE DATA
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