82545GM Просмотр технического описания (PDF) - Intel
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82545GM Datasheet PDF : 55 Pages
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82545GM — Networking Silicon
Table 5.d
Complete Subsystem
(including magnetics, LED, and regulator circuits)
3.3 V
2.5 V
1.5 V
Subsystem
3.3 V
Current
D3cold / Wake
disabled
Typa Icc Maxb Icc
(mA)
(mA)
40
45
30
30
10
10
85 mA
D3cold / Wake
Enabled at 10 Mbps
Typ Icc
(mA)
Max Icc
(mA)
60
65
40
40
30
35
140 mA
D3cold / Wake
Enabled at 100 Mbps
Typ Icc
(mA)
Max Icc
(mA)
60
65
85
90
55
60
215 mA
D0 at 1000 Mbps
Typ Icc
(mA)
140
260
400
Max Icc
(mA)
160
270
425
855 mA
a. Typical conditions: operating temperature (TA) = 25 C, nominal voltages, moderate network traffic at full duplex, and PCI 66 MHz
system interface.
b. Maximum conditions: minimum operating temperature (TA) values, maximum voltage values, and PCI-X 100 to 133 MHZ system
interface.
NOTE: Component power has been specified separately from subsystem power to aid in calculating thermal
operation and in providing external power supply circuits. Complete subsystem power is specified to aid
in providing overall power supply design for the applications.
Table 6.a MAC/SERDES Characteristics
Component Only
D0a
(SERDES Active)
D3cold - Wake
Disabled
(SERDES Off)
3.3 V
2.5 V
1.5 V
Total
Device
Power
Typ Icc
(mA)
65
60
115
Max Icc
(mA)
75
70
130
Typ Icc
(mA)
45
leakage
5
Max Icc
(mA)
50
leakage
5
540 mW 660 mW 150 mW 200 mW
26
Datasheet
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