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24AA128_04 Просмотр технического описания (PDF) - Microchip Technology

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24AA128_04
Microchip
Microchip Technology Microchip
24AA128_04 Datasheet PDF : 26 Pages
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24AA128/24LC128/24FC128
TABLE 1-2: AC CHARACTERISTICS (CONTINUED)
AC CHARACTERISTICS
Electrical Characteristics:
Industrial (I):
VCC = +1.8V to 5.5V TA = -40°C to +85°C
Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C
Param.
No.
Sym.
Characteristic
Min.
Max. Units
Conditions
12
THD:WP WP hold time
4700
1300
1300
ns 1.8V VCC < 2.5V
2.5V VCC 5.5V
1.8V VCC 5.5V 24FC128
13
TAA Output valid from clock
(Note 2)
3500
ns 1.8V VCC < 2.5V
900
2.5V VCC 5.5V
900
1.8V VCC < 2.5V 24FC128
400
2.5V VCC 5.5V 24FC128
14
TBUF Bus free time: Time the bus
4700
must be free before a new
1300
transmission can start
1300
500
ns 1.8V VCC < 2.5V
2.5V VCC 5.5V
1.8V VCC < 2.5V 24FC128
2.5V VCC 5.5V 24FC128
15
TOF Output fall time from VIH
10 + 0.1CB 250
minimum to VIL maximum
250
CB 100 pF
ns All except, 24FC128 (Note 1)
24FC128 (Note 1)
16
TSP Input filter spike suppression
(SDA and SCL pins)
50
ns All except, 24FC128 (Notes 1
and 3)
17
TWC Write cycle time (byte or
5
ms —
page)
18
Endurance
1,000,000
cycles 25°C (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site:
www.microchip.com.
FIGURE 1-1:
BUS TIMING DATA
SCL
SDA
IN
SDA
OUT
5
7
3
6
16
2
8
D4
9
13
4
10
14
(protected)
WP
11
12
(unprotected)
DS21191M-page 4
2004 Microchip Technology Inc.

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