MCT0603-250.1PW4K64 Просмотр технического описания (PDF) - Vishay Semiconductors
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MCT0603-250.1PW4K64 Datasheet PDF : 11 Pages
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MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
www.vishay.com
Vishay Beyschlag
DIMENSIONS
Tt
W WT
H
Tb
L
DIMENSIONS AND MASS
TYPE
H
(mm)
L
(mm)
MCS 0402 0.32 ± 0.05
1.0 ± 0.05
MCT 0603 0.45 + 0.1/- 0.05 1.55 ± 0.05
MCU 0805 0.45 + 0.1/- 0.05
2.0 ± 0.1
MCA 1206
0.55 ± 0.1
3.2 + 0.1/- 0.2
W
(mm)
0.5 ± 0.05
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
WT
(mm)
> 75 % of W
> 75 % of W
> 75 % of W
> 75 % of W
Tt
(mm)
Tb
(mm)
0.2 + 0.1/- 0.15
0.2 ± 0.1
0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2
0.5 ± 0.25
0.5 ± 0.25
MASS
(mg)
0.6
1.9
4.6
9.2
SOLDER PAD DIMENSIONS
G
X
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE
G
(mm)
WAVE SOLDERING
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
REFLOW SOLDERING
Y
(mm)
X
(mm)
Z
(mm)
MCS 0402
-
-
-
-
0.35
0.55
0.55
1.45
MCT 0603
0.55
1.10
1.10
2.75
0.65
0.70
0.95
2.05
MCU 0805
0.80
1.25
1.50
3.30
0.90
0.90
1.40
2.70
MCA 1206
1.40
1.50
1.90
4.40
1.50
1.15
1.75
3.80
Note
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation
mode”.
Revision: 16-Jan-13
3
Document Number: 28700
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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