EMIF06-USD05F3 Просмотр технического описания (PDF) - STMicroelectronics
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EMIF06-USD05F3
STMicroelectronics
EMIF06-USD05F3 Datasheet PDF : 8 Pages
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EMIF06-USD05F3
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Package information
Package information
• Epoxy meets UL94, V0
• Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 10. Package dimensions
400 µm ± 40
255 µm ± 40
500 µm ± 50
1.58 mm ± 40 µm
190 µm ± 10
Figure 11. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Figure 12. Marking
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing
location
yww = datecode
y = year,
ww = week
xxz
y ww
DocID025910 Rev 1
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