DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

AXN380C130P Просмотр технического описания (PDF) - Panasonic Corporation

Номер в каталоге
Компоненты Описание
производитель
AXN380C130P
Panasonic
Panasonic Corporation Panasonic
AXN380C130P Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
AXN(1/3/4)
ORDERING INFORMATION
1. P8 (11.5 mm)
AXN 1
1: Narrow Pitch Connector P8 (0.8 mm pitch)
Socket and header are common
Number of pins (2 digits)
Suction cover
Nil: Without suction tape
C: With suction tape
Terminal shape/Mated direction/Mated height
0: For SMD vertical mating, mated height 11.5 mm
Functions
1: With soldering terminals, with positioning bosses
Surface treatment (Contact portion / Terminal portion)
1: Ni plating on base, Au plating on surface / Ni plating on base, Au plating on surface
Other specifications
5: Part control number
Packing
P: Embossed tape and paper reel × 2
S: Tube package
0115
2. P8 (3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm, 5.0 mm, 5.5 mm, 6.0 mm, 7.0 mm, 8.0 mm, 13.0 mm, 14.0 mm)
AXN
3: Narrow Pitch Connector P8 (0.8 mm pitch) Socket
4: Narrow Pitch Connector P8 (0.8 mm pitch) Header
Number of pins (2 digits)
Suction tape and cover
Nil: Socket; without suction tape, Header; without suction cover
C: Socket; with suction tape, Header; with suction cover
Mated height
<Socket>
0: For mated height 3.0 mm, 4.0 mm and 5.0 mm
1: For mated height 6.0 mm, 7.0 mm, 8.0 mm, 13.0 mm and 14.0 mm
2: For mated height 3.5 mm, 4.5 mm and 5.5 mm
<Header>
0: For mated height 13.0 mm
1: For mated height 14.0 mm
3: For mated height 3.0 mm, 3.5 mm and 6.0 mm
4: For mated height 4.0 mm, 4.5 mm and 7.0 mm
5: For mated height 5.0 mm, 5.5 mm and 8.0 mm
Functions
3: With positioning bosses
(Except for mated height 13.0 mm header, embossed tape packing)
4: Without positioning bosses
(Mated height 13.0 mm header, embossed tape packing and mated height 14.0 mm header only)
Surface treatment (Contact portion / Terminal portion)
<Socket>
0: Ni plating on base, Au plating on surface / Ni plating on base, Au plating on surface (Applies to mated heights of 6.0 to 14.0 mm.)
8: Ni plating on base, Au plating on surface / Ni plating on base, Au plating on surface (Applies to mated heights of 3.0 to 5.5 mm.)
<Header>
0: Ni plating on base, Au plating on surface / Ni plating on base, Au plating on surface
Packing
J: 1,500 pieces embossed tape and paper reel × 2
P: 1,000 pieces embossed tape and paper reel × 2
S: Tube package
Notes: 1. The tape width for 100-pin embossed tape packaging is non-JIS standard. Please inquire.
2. The depth of the embossed tape for headers with 13 mm and 14 mm mated heights is non-JIS standard. Please test with your mounter before using.
3. Models possible for “J” packaging are as follows:
Socket mated heights: 3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm, 5.0 mm, and 5.5 mm
Headers: Mated heights 3.0 mm, 3.5 mm, and 6.0 mm
Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/
ACCTB25E 201303-T

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]