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AXN426430P

Narrow pitch connectors (0.8mm pitch)

Panasonic Corporation 

Notes on Using Narrow pitch Connectors

Regarding soldering

1. Reflow soldering

1) Measure the recommended profile

temperature for reflow soldering by

placing a sensor on the PC board near

the connector surface or terminals. (The

setting for the sensor will differ depending

on the sensor used, so be sure to

carefully read the instructions that comes

with it.)

2) As for cream solder printing, screen

printing is recommended.

3) To determine the relationship between

the screen opening area and the PC-

board foot pattern area, refer to the

diagrams in the recommended patterns

for PC boards and metal masks. Make

sure to use the terminal tip as a reference

position when setting. Avoid an excessive

amount of solder from being applied,

otherwise, interference by the solder will

cause an imperfect contact.

Terminal

Paste

solder

PC board

foot pattern

4) Consult us when using a screen-

printing thickness other than that

recommended.

5) When mounting on both sides of the

PC board and the connector is mounting

on the underside, use adhesives or other

means to ensure the connector is

properly fixed to the PC board. (Double

reflow soldering on the same side is

possible.)

6) N2 reflow, conducting reflow soldering

in a nitrogen atmosphere, increases the

solder flow too greatly, enabling wicking

to occur. Make sure that the solder feed

rate and temperature profile are

appropriate.

Soldering conditions

Please use the reflow temperature profile

conditions recommended below for

reflow soldering. Please contact us

before using a temperature profile other

than that described below (e.g. lead-free

solder).

• Narrow pitch connectors

(except P8 type)

Upper limited (Solder heat resistance)

Lower limited (Solder wettability)

Temperature

Peak temperature 260°C

230°C

180°C

150°C

Peak temperature

Preheating

220°C

200°C

60 to 120 sec.

25 sec.

70 sec.

Time

• Narrow pitch connector (P8)

Temperature

245°C max.

155 to 165°C

Peak temperature

Preheating

200°C

60 to 120 sec.

Within 30 sec.

Time

For products other than the ones above,

please refer to the latest product

specifications.

7) The temperatures are measured at the

surface of the PC board near the

connector terminals. (The setting for the

sensor will differ depending on the sensor

used, so be sure to carefully read the

instructions that comes with it.)

8) The temperature profiles given in this

catalog are values measured when using

the connector on a resin-based PC

board. When performed reflow soldering

on a metal board (iron, aluminum, etc.) or

a metal table to mount on a FPC, make

sure there is no deformation or

discoloration of the connector beforehand

and then begin mounting.

9) Consult us when using a screen-

printing thickness other than that

recommended.

10) Some solder and flux types may

cause serious solder or flux creeping.

Solder and flux characteristics should be

taken into consideration when setting the

reflow soldering conditions.

2. Hand soldering

1) Set the soldering iron so that the tip

temperature is less than that given in the

table below.

Table A

Product name

Soldering iron temperature

SMD type connectors

300°C within 5 sec.

350°C within 3 sec.

2) Do not allow flux to spread onto the

connector leads or PC board. This may

lead to flux rising up to the connector

inside.

3) Touch the soldering iron to the foot

pattern. After the foot pattern and

connector terminal are heated, apply the

solder wire so it melts at the end of the

connector terminals.

Apply the solder

wire here

Solderirinogn

Terminal

Small angle as

possible up to

45 degrees

PC board

Pattern

4) Be aware that soldering while applying

a load on the connector terminals may

cause improper operation of the

connector.

5) Thoroughly clean the soldering iron.

6) Flux from the solder wire may get on

the contact surfaces during soldering

operations. After soldering, carefully

check the contact surfaces and clean off

any solder before use.

7) For soldering of prototype devices

during product development, you can

perform soldering at the necessary

locations by heating with a hot-air gun by

applying cream solder to the foot pattern

beforehand. However, at this time, make

sure that the air pressure does not move

connectors by carefully holding them

down with tweezers or other similar tool.

Also, be careful not to go too close to the

connectors and melt any of the molded

components.

8) If an excessive amount of solder is

applied during manual soldering, the

solder may creep up near the contact

points, or solder interference may cause

imperfect contact.

3. Solder reworking

1) Finish reworking in one operation.

2) For reworking of the solder bridge, use

a soldering iron with a flat tip. To prevent

flux from climbing up to the contact

surfaces, do not add more flux.

3) Keep the soldering iron tip temperature

below the temperature given in Table A.

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

ACCTB48E 201303-T

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