ITG3200 Просмотр технического описания (PDF) - Unspecified
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ITG3200 Datasheet PDF : 39 Pages
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ITG-3200 Product Specification
Document Number: PS-ITG-3200A-00-01.4
Revision: 1.4
Release Date: 03/30/2010
CONTENTS
1 DOCUMENT INFORMATION.............................................................................................................................. 4
1.1 REVISION HISTORY ............................................................................................................................................. 4
1.2 PURPOSE AND SCOPE........................................................................................................................................... 5
1.3 PRODUCT OVERVIEW .......................................................................................................................................... 5
1.4 APPLICATIONS ..................................................................................................................................................... 5
2 FEATURES............................................................................................................................................................... 6
3 ELECTRICAL CHARACTERISTICS .................................................................................................................. 7
3.1 SENSOR SPECIFICATIONS ..................................................................................................................................... 7
3.2 ELECTRICAL SPECIFICATIONS.............................................................................................................................. 8
3.3 ELECTRICAL SPECIFICATIONS, CONTINUED ......................................................................................................... 9
3.4 ELECTRICAL SPECIFICATIONS, CONTINUED ........................................................................................................10
3.5 I2C TIMING CHARACTERIZATION........................................................................................................................11
3.6 ABSOLUTE MAXIMUM RATINGS.........................................................................................................................12
4 APPLICATIONS INFORMATION ......................................................................................................................13
4.1 PIN OUT AND SIGNAL DESCRIPTION ...................................................................................................................13
4.2 TYPICAL OPERATING CIRCUIT............................................................................................................................14
4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ...........................................................................................14
4.4 RECOMMENDED POWER-ON PROCEDURE...........................................................................................................15
5 FUNCTIONAL OVERVIEW.................................................................................................................................16
5.1 BLOCK DIAGRAM ...............................................................................................................................................16
5.2 OVERVIEW .........................................................................................................................................................16
5.3 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING..........................................16
5.4 I2C SERIAL COMMUNICATIONS INTERFACE ........................................................................................................17
5.5 CLOCKING ..........................................................................................................................................................17
5.6 SENSOR DATA REGISTERS ..................................................................................................................................17
5.7 INTERRUPTS .......................................................................................................................................................17
5.8 DIGITAL-OUTPUT TEMPERATURE SENSOR .........................................................................................................17
5.9 BIAS AND LDO...................................................................................................................................................17
5.10 CHARGE PUMP ...................................................................................................................................................17
6 DIGITAL INTERFACE .........................................................................................................................................18
6.1 I2C SERIAL INTERFACE .......................................................................................................................................18
7 REGISTER MAP ....................................................................................................................................................22
8 REGISTER DESCRIPTION..................................................................................................................................23
8.1 REGISTER 0 – WHO AM I ....................................................................................................................................23
8.2 REGISTER 21 – SAMPLE RATE DIVIDER ..............................................................................................................23
8.3 REGISTER 22 – DLPF, FULL SCALE....................................................................................................................24
8.4 REGISTER 23 – INTERRUPT CONFIGURATION......................................................................................................26
8.5 REGISTER 26 – INTERRUPT STATUS ....................................................................................................................26
8.6 REGISTERS 27 TO 34 – SENSOR REGISTERS.........................................................................................................27
8.7 REGISTER 62 – POWER MANAGEMENT ...............................................................................................................27
9 ASSEMBLY .............................................................................................................................................................29
9.1 ORIENTATION .....................................................................................................................................................29
9.2 PACKAGE DIMENSIONS.......................................................................................................................................30
9.3 PACKAGE MARKING SPECIFICATION ..................................................................................................................31
9.4 TAPE & REEL SPECIFICATION.............................................................................................................................31
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