AU80610006225AASLBXC Просмотр технического описания (PDF) - Intel
Номер в каталоге
Компоненты Описание
производитель
AU80610006225AASLBXC Datasheet PDF : 80 Pages
| |||
4.5
4.6
4.7
4.8
4.9
4.10
Catastrophic Thermal Protection ..........................................................................40
Reserved or Unused Signals ................................................................................40
Signal Groups ...................................................................................................41
Test Access Port (TAP) Connection .......................................................................41
Absolute Maximum and Minimum Ratings..............................................................41
DC Specifications ...............................................................................................43
4.10.1 Flexible Motherboard Guidelines (FMB) ......................................................43
4.10.2 Voltage and Current Specifications ............................................................43
4.10.3 DC Specifications ....................................................................................47
5 Signal Quality Specifications ....................................................................................54
6 Low Power Features ................................................................................................55
6.1 Low Power States ..............................................................................................55
6.1.1 Processor Core Low Power States..............................................................55
6.1.2 Processor Core C-states Description ..........................................................57
7 Thermal Specifications and Design Considerations...................................................59
7.1 Thermal Specifications........................................................................................59
7.1.1 Thermal Diode........................................................................................60
7.1.2 Intel® Thermal Monitor ...........................................................................62
7.1.3 Digital Thermal Sensor ............................................................................64
7.1.4 Out of Specification Detection...................................................................64
7.1.5 PROCHOT# Signal Pin .............................................................................65
8 Package Mechanical Specifications and Ball Information..........................................66
8.1 Package Mechanical Specifications .......................................................................66
8.1.1 Package Mechanical Drawings...................................................................66
8.1.2 Package Loading Specifications .................................................................67
8.2 Processor Ballout Assignment ..............................................................................67
9 Debug Tool Specifications ........................................................................................79
10 Testability ...............................................................................................................80
10.1 JTAG Boundary Scan ..........................................................................................80
4
Datasheet
Share Link: 