SMCJ Просмотр технического описания (PDF) - STMicroelectronics
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SMCJ Datasheet PDF : 10 Pages
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SMCJ
Characteristics
Figure 6.
C(nF)
10.00
1.00
0.10
Junction capacitance versus
Figure 7.
reverse applied voltage for
unidirectional types (typical values)
SMCJ5.0A
SMCJ12A
SMCJ24A
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
C(nF)
10.00
1.00
SMCJ40A
SMCJ85A
SMCJ188A
0.10
Junction capacitance versus
reverse applied voltage for
bidirectional types (typical values)
SMCJ5.0CA
SMCJ12CA
SMCJ24CA
SMCJ40CA
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
SMCJ85CA
SMCJ188CA
0.01
1
VR(V)
10
100
1000
0.01
1
VR(V)
10
100
1000
Figure 8. Peak forward voltage drop
versus peak forward current
(typical values)
IFM(A)
1.0E+02
Figure 9. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
1.00
Zth(j-a) / Rth(j-a)
Recommended pad layout
PCB FR4, copper thickness = 35 µm
1.0E+01
1.0E+00
Tj =125 °C
Tj =25 °C
0.10
VFM(V)
1.0E-01
0.01
tP(s)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 11. Leakage current versus junction
temperature (typical values)
Rth(j-a) (°C/W)
100
90
PCB FR4, copper thickness = 35 µm
IR (nA)
1.0E+04
80
1.0E+03
70
VR=VRM
60
VRM < 10 V
50
1.0E+02
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
1.0E+01
1.0E+00
25
VR=VRM
VRM ≥ 10 V
50
75
100
Tj(°C)
125
150
Doc ID 5617 Rev 8
5/10
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