L5150GJ Просмотр технического описания (PDF) - STMicroelectronics
Номер в каталоге
Компоненты Описание
производитель
L5150GJ Datasheet PDF : 29 Pages
| |||
L5150GJ
2
Electrical specifications
Electrical specifications
2.1
Absolute maximum ratings
Stressing the device above the rating listed in the Table 3: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 3. Absolute maximum ratings
Symbol
Parameter
Vsdc
Isdc
Vodc
Iodc
Vod Res
Iod Res
VRes_adj
Vod EWo
Iod EWo
Vcr
VEWi
VEn
Tj
VESD HBM
VESD CDM
DC supply voltage
Input current
DC output voltage
DC output current
Open drain output voltage Res
Open drain output current Res
VRes_adj voltage
Open drain output voltage EWo
Open drain output current EWo
Vcr voltage
Early warning input voltage
Enable input
Junction temperature
ESD HBM voltage level (HBM-MIL STD 883C)
ESD CDM voltage level (CDM- )
Value
Unit
-0.3 to 40
V
Internally limited
-0.3 to 6
V
Internally limited
-0.3 to Vodc + 0.3
V
Internally limited
-0.3 to Vodc + 0.3
V
-0.3 to Vodc + 0.3
V
Internally limited
-0.3 to Vo + 0.3
V
-0.3 to 40
V
-0.3 to 40
V
-40 to 150
°C
+/- 2
kV
+/- 750
V
2.2
Thermal data
Table 4. Thermal data(1)
Symbol
Parameter
Value
Unit
Rthj-case
Rthj-amb
Thermal resistance junction to case:
PowerSSO-12
Thermal resistance junction to ambient:
PowerSSO-12
20
°K/W
52
°K/W
1. The values quoted are for PCB 77 mm x 86 mm x 1.6 mm, FR4, double copper layer with single heatsink
layer, copper thickness 70 µm, thermal vias, copper area 2 cm2.
Doc ID 15540 Rev. 12
7/29
Share Link: 