NTE5671 Просмотр технического описания (PDF) - NTE Electronics
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NTE5671 Datasheet PDF : 3 Pages
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Electrical Characteristics:
Parameter
(TJ = +25°C, unless otherwise specified. Polarities, positive or negative,
are identified with respect to MT1.)
Symbol
Test Conditions
Min Typ Max Unit
On–State Voltage (Measured under pulse
conditions to prevent excessive
dissipation)
VT IT = 20A
– – 1.6 V
Rate of Rise of Off–State Voltage
(That will not trigger any device)
dVD/dt TJ = +120°C, Gate Open – – 100 V/µs
Rate of Change of Commutating Voltage
(That will not trigger any device)
dVcom/dt –dIcom/dt = 7.2A/ms,
– 10 – V/µs
IT(RMS) = 16A, TH = 70°C,
VD = 400V, Gate Open
Off–State Current
ID VD = 400V, TJ = +120°C – – 0.5 mA
Gate Voltage (That will trigger all devices)
VGT
1.5 – – V
Gate Voltage (That will not trigger any device)
MT2 (+), G (+); MT2 (–), G (–)
VGD VD = 400V, TJ = +120°C – – 250 mV
Gate Current (That will trigger all devices)
MT2 (+), G (+)
IGT G to MT1
35 – – Ma
MT2 (+), G (–)
35 – – mA
MT2 (–), G (–)
35 – – mA
MT2 (–), G (+)
70 – – mA
Holding Current
Latching Current
MT2 (+), G (+)
MT2 (+), G (–)
IH
IL VD = 12V
– – 30 mA
– – 40 Ma
– – 60 mA
MT2 (–), G (–)
– – 40 mA
MT2 (–), G (+)
– – 60 mA
Mounting Instructions:
1. The TRIAC may be soldered directly into the circuit, but the maximum permissible temperature
of the soldering iron or bath is +275°C; it must not be in contact with the joint for more than 5 seconds.
Soldered joints must be at least .185” (4.7mm) from the seal.
2. The leads should not be bent less than .094” (2.4mm) from the seal, and should be supported during
bending. The leads can be bent, twisted or straightened by 90° maximum. The minimum bending
radius is .039” (1mm).
3. Mounting by means of a spring clip (not provided by NTE) is the best mounting method because
if offers good thermal contact under the crystal area and slightly lower RthJH values than screw
mounting. However, if a screw is used, it should be an M3 cross–recess pan–head. Care should
be taken to avoid damage to the plastic body.
4. For good thermal contact, heatsink compound should be used between the seating plane and the
heatsink. values of RthJH given for mounting with heatsink compound refer to the use of a metallic–
oxide loaded compound. Ordinary silicone grease is not recommended.
5. Rivit mounting is not recommended.
6. The heatsink must have a flatness in the mounting area of .0007 (.02mm) maximum per .393
(10mm). Mounting holes must be deburred.
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