PMXB350UPE Просмотр технического описания (PDF) - NXP Semiconductors.

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производитель

PMXB350UPE

20 V, P-channel Trench MOSFET

NXP Semiconductors. 

NXP Semiconductors

13. Soldering

Footprint information for reflow soldering of DFN1010D-3 package

PMXB350UPE

20 V, P-channel Trench MOSFET

SOT1215

1.2

0.45 (2x)

0.3

1.1

0.35 (2x)

0.25 (2x)

0.4

0.75

0.5

1.5 1.4 0.4

0.5

0.3 0.4

0.5 1.3

0.3 0.4

0.3

0.4

0.5

1.3

solder land

solder land plus solder paste

occupied area

solder resist

Dimensions in mm

Issue date

12-11-23

13-03-06

Fig. 20. Reflow soldering footprint for DFN1010D-3 (SOT1215)

PMXB350UPE

Product data sheet

All information provided in this document is subject to legal disclaimers.

24 January 2014

sot1215_fr

© NXP N.V. 2014. All rights reserved

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