T8100 Просмотр технического описания (PDF) - Intel

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T8100

Intel® Core™2 Duo Processor and Intel® Core™2 Extreme Processor on 45-nm Process for Platforms Based on Mobile Intel® 965 Express Chipset Family

Intel 

Introduction

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Note:

Introduction

The Intel® Core™2 Duo processor and Intel® Core™2 Extreme processor built on 45-

nanometer process technology are the next generation high-performance, low-power

mobile processors based on the Intel® Core™ microarchitecture. The Intel Core 2 Duo

processor and Intel Core 2 Extreme processor support the Mobile Intel® 965 Express

Chipset and Intel® 82801HBM ICH8 Controller Hub-Based Systems. The document

contains electrical, mechanical and thermal specifications for the following processors:

• Intel Core 2 Duo processor - Standard Voltage

• Intel Core 2 Extreme processor

In this document, the Intel Core 2 Duo processor and Intel Core 2 Extreme mobile

processor built on 45-nm process technology are referred to as the processor. The

Mobile Intel® 965 Express Chipset family is referred to as the (G)MCH.

The following list provides some of the key features on this processor:

• Dual-core processor for mobile with enhanced performance.

• Supports Intel® architecture with Intel® Wide Dynamic Execution.

• Supports L1 cache-to-cache (C2C) transfer.

• Supports PSI2 functionality.

• Supports Enhanced Intel® Virtualization Technology.

• On-die, primary 32-KB instruction cache and 32-KB write-back data cache in each

core.

• On-die, up to 6-MB second-level shared cache with Advanced Transfer Cache

Architecture.

• Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3),

Supplemental Streaming SIMD Extensions 3 (SSSE3) and SSE4.1 Instruction Sets.

• 800-MHz Source-Synchronous front side bus (FSB).

• Advanced power management features including Enhanced Intel SpeedStep®

Technology and Dynamic FSB frequency switching.

• Digital Thermal Sensor (DTS).

• Intel® 64 architecture.

• Intel® Dynamic Acceleration Technology and Enhanced Multi-Threaded Thermal

Management (EMTTM).

• Micro-FCPGA and Micro-FCBGA packaging technologies (Extreme Edition only

available in Micro-FCPGA).

• Execute Disable Bit support for enhanced security.

• Deep Power-Down Technology with P_LVL6 I/O Support.

• Half-ratio support (N/2) for Core-to-Bus ratio.

Datasheet

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