E-L6258 Просмотр технического описания (PDF) - STMicroelectronics
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E-L6258 Datasheet PDF : 32 Pages
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Block diagram
L6258
Figure 3. Thermal characteristics
Conditions
Power Dissipated T Ambient Thermal J-A resistance
(W)
(˚C)
(˚C/W)
pad layout + ground layers + 16 via hol
PCB ref.: 4 LAYER cm 12 x 12
5.3
70
15
pad layout + ground layers
PCB ref.: 4 LAYER cm 12 x 12
4.0
70
20
pad layout + 6cm2 on board heat sink
PCB ref.: 2 LAYER cm 12 x 12
2.3
70
35
D02IN1370
12
10
8
6
4
2
0
0
15˚C/W
20˚C/W
35˚C/W
20
40
60
80
100
120
140
160
Ambient Temperature (˚C)
D02IN1371
Table 4.
Electrical characteristics
(VS = 40V; VDD = 5V; Tj = 25°; unless otherwise specified.)
Parameter
Description
Test condition
Min. Typ.
Max. Unit
VS
VDD
VBOOT
VSense
VS(off)
VDD(off)
IS(on)
IS(off)
IDD
Supply voltage
Logic supply voltage
Storage voltage
Max drop across sense
resistor
Power off reset
Power off reset
VS quiescent current
VS quiescent current
VDD operative current
VS = 12 to 40V
Off threshold
Off threshold
Both bridges ON, no
load
Both bridges OFF
12
4.75
VS+6
6
3.3
34
V
5.25 V
VS+12 V
1.25 V
7.2 V
4.1 V
15 mA
7 mA
15 mA
8/32
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