UPD16326AGB-3B4 Просмотр технического описания (PDF) - NEC => Renesas Technology

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UPD16326AGB-3B4

32-BIT FLUORESCENT DISPLAY TUBE DRIVER

NEC => Renesas Technology 

µPD16326A

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the conditions recommended below.

For soldering methods and conditions other than those recommended, please contact your NEC sales representative.

SURFACE MOUNT TYPE

For details of recommended soldering conditions, refer to the information document “Semiconductor Device

Mounting Technology Manual” (C10535E).

µPD16326GB-3B4

Soldering Method

Infrared reflow

VPS

Wave soldering

Pin partial heating

Soldering Conditions

Package peak temperature: 235 ˚C, Duration: 30 sec. MAX.

(at 210 ˚C or above), Number of times: Twice, Time limit: NoneNote

Package peak temperature: 215 ˚C, Duration: 40 sec. MAX.

(at 200 ˚C or above), Number of times: Twice, Time limit: NoneNote

Solder bath temperature: 260 ˚C MAX., Duration: 10 sec. MAX.,

Number of times: Once, Time limit: NoneNote

Pin partial temperature: 300 ˚C MAX., Duration: 10 sec. MAX.,

Time limit: NoneNote

Recommended

Condition Symbol

IR35-00-2

VP15-00-2

WS60-00-1

Note For the storage period after dry-pack decapsulation, storage conditions are max. 25 ˚C, 65 % RH.

Caution Use of more than one soldering method should be avoided (except in the case of pin partial

heating).

REFERENCES

NEC Semiconductor Device Reliability/Quality Control System (IEI-1212)

Quality Grade on NEC Semiconductor Devices (C11531E)

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