SM6HT(2005) Просмотр технического описания (PDF) - STMicroelectronics

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производитель

SM6HT
(Rev.:2005)

HIGH TEMPERATURE TRANSIL™ FOR AUTOMOTIVE APPLICATIONS

STMicroelectronics 

SM6HT

Figure 7: Variation of thermal impedance

junction to ambient versus pulse duration

(Printed circuit board FR4 with recommended

pad layout)

Zth(j-a)(°C/W)

1E+2

1E+1

1E+0

1E-1

1E-3

1E-2

tp(ms)

1E-1

1E+0

1E+1

1E+2 5E+2

Figure 8: Thermal resistance junction to

ambient versus copper surface under each

lead (printed circuit board FR4, e(Cu)=35µm)

Rth(j-a)(°C/W)

100

90

80

70

60

50

S(cm²)

40

0

1

2

3

4

5

Figure 9: Variation of leakage current versus

junction temperature (typical values)

IR(µA)

2E+0

1E+0

1E-1

Tj(°C)

4E-2

25

50

75

100

125

150

175

4/6

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