DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

RMPA39000 Просмотр технического описания (PDF) - Fairchild Semiconductor

Номер в каталоге
Компоненты Описание
производитель
RMPA39000
Fairchild
Fairchild Semiconductor Fairchild
RMPA39000 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Vg
(Negative)
2 mil Gap
5mil Thick
Alumina
50
RF
Input
10,000 pF
100 pF
10,000 pF
100 pF
Vd
(Positive)
Die-Attach
80Au/20Sn
5 mil Thick
Alumina
50
RF
Output
L< 0.015"
(4 Plcs)
100 pF
100 pF
10,000 pF
Vg
(Negative)
Vd
(Positive)
10,000 pF
Note:
Use 0.003" x 0.0005" Gold Ribbon for bonding. RF input and output bonds should be less than 0.015" long with stress relief.
Vd should be biased from 1 supply on both sides as shown. Vg can be biased from either or both sides from 1 supply.
Figure 4. Recommended Assembly and Bonding Diagram
©2004 Fairchild Semiconductor Corporation
RMPA39000 Rev. D

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]