U0408FC12C(2002) Просмотр технического описания (PDF) - ProTek Devices.

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Компоненты Описание

производитель

U0408FC12C
(Rev.:2002)

BIDIRECTIONAL UNBUMPED FLIP CHIP

ProTek Devices. 

PACKAGE OUTLINE & DIMENSIONS

PACKAGE OUTLINE

U0408FC3.3C

thru

U0408FC36C

U0408

Picture Not Available

PACKAGE DIMENSIONS

TOP

DIM MILLIMETERS

INCHES

E

F

Metalized Die Contact

END

I

A

0.56 NOM 0.022 NOM

B

0.86 NOM 0.034 NOM

C 0.99 ± 0.0254 0.039 ± 0.001

E

0.15 SQ

0.006 SQ

F 2.0 ± 0.0254 0.079 ± 0.001

I

0.42 NOM 0.0165 NOM

MOUNTING PAD - Option 1

PAD DIMENSIONS

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and

DIM Millimeters Inches

outline: .xxx ± 0.05mm (± 0.002”).

C

A

D

A

0.51

C

0.30

0.020

0.012

D

0.46

0.018

DIE

SOLDER

CONTACT

E

0.20

0.008

F 0.15 SQ 0.006 SQ TAPE & REEL ORIENTATION

G

0.71

0.028

H

0.99

0.039

I

0.5

0.02

NOTE:

Preferred: Using 0.1mm

(0.004”) stencil.

I

SOLDER PRINT 0.010” - 0.012” DIA.

SOLDER PADS

SOLDER

MASK

TAPE & REEL PACKAGING:

Surface mount product is taped and reeled in accordance with EIA-481, reel quantites and sizes are as follows:

Paper Tape: 7 Inch Reel - 3,000 or 10,000 pieces per reel. Plastic Tape: 7 Inch Reel - 3,000 or 5,000 per reel.

Quad Die - 0408

NOTE:

1. Top view of tape. Solder bumps are face

down in tape package.

06026 Rev 1 - 2/02

05161.R0 3/02

4

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