MC44602 Просмотр технического описания (PDF) - ON Semiconductor
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MC44602 Datasheet PDF : 18 Pages
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MC44602
MAXIMUM RATINGS
Rating
Total Power Supply and Zener Current
Sink Ground Voltage
with Respect to Gnd (Pin 9)
Symbol
(ICC + IZ)
VSink(neg)
Output Supply Voltage
VC
with Respect to Sink Gnd (Pins 4, 5, 12, 13)
Output Current (Note 1)
Source
Sink
Output Energy (Capacitive Load per Cycle)
IO(Source)
IO(Sink)
W
Current Sense and Voltage Feedback Inputs
Vin
Sync Input
High State Voltage
VIH
Low State Reverse Current
IIL
Load Detect Input Current
Iin
Error Amplifier Output Sink Current
IEA (Sink)
Power Dissipation and Thermal Characteristics
Maximum Power Dissipation at TA = 25°C
Thermal Resistance, Junction–to–Air
Thermal Resistance, Junction–to–Case
PD
RθJA
RθJC
Operating Junction Temperature
TJ
Operating Ambient Temperature
TA
NOTE: 1. Maximum package power dissipation limits must be observed.
Value
30
–5.0
20
1.0
1.5
5.0
–0.3 to 5.5
5.5
–20
–20 to +10
10
2.5
80
15
150
–25 to +85
Unit
mA
V
V
A
µJ
V
V
mA
mA
mA
W
°C/W
°C/W
°C
°C
ELECTRICAL CHARACTERISTICS (VCC and VC = 12 V [Note 2], RT = 10k, CT = 1.0 nF, for typical values TA = 25°C, for min/max
values TA = –25°C to +85°C [Note 3] unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
ERROR AMPLIFIER SECTION
Voltage Feedback Input (VO = 2.5V)
VFB
2.45
2.5
2.65
V
Input Bias Current (VFB = 2.5 V)
IIB
–
–0.6
–2.0
µA
Open Loop Voltage Gain (VO = 2.0 V to 4.0 V)
AVOL
65
90
–
dB
Unity Gain Bandwidth
TJ = 25°C
TA = –25 to +85°C
BW
MHz
1.0
1.4
1.8
0.8
–
2.0
Power Supply Rejection Ratio (VCC = 10 V to 16 V)
PSRR
65
70
–
dB
Output Current
Sink (VO = 1.5 V, VFB = 2.7 V)
Sink TJ = 25°C
Sink TA = –25 to +85°C
ISink
mA
–
5.0
–
1.5
–
10
Source (VO = 5.0 V, VFB = 2.3 V)
Source TJ = 25°C
Source TA = –25 to +85°C
ISource
–
–1.1
–
–2.0
–
–0.2
Output Voltage Swing
High State (IO(Source) = 0.5 mA, VFB = 2.3 V)
Low State (IO(Sink) = 0.33 mA, VFB = 2.7 V)
VOH
VOL
V
6.0
7.0
–
–
1.0
1.1
NOTES: 2. Adjust VCC above the startup threshold before setting to 12V.
3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
2
MOTOROLA ANALOG IC DEVICE DATA
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