EMIF02-MIC02F1 Просмотр технического описания (PDF) - STMicroelectronics
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EMIF02-MIC02F1 Datasheet PDF : 6 Pages
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PACKAGE MECHANICAL DATA
FLIP CHIP
500µm ± 50
315µm ± 50
EMIF02-MIC02F1
650µm ± 65
1.07mm ± 50µm
FOOT PRINT RECOMMENDATIONS
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
MARKING
Dot, ST logo
xxx = marking
yww = datecode
(y = year
ww = week)
All dimensions in µm
365
240
xxx
y ww
5/6
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