BYW29-200 Просмотр технического описания (PDF) - STMicroelectronics
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BYW29-200 Datasheet PDF : 7 Pages
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Fig.11 : Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35µm) for
D2PAK.
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
S(cm²)
0
0
2
4
6
8
10 12 14 16 18 20
PACKAGE MECHANICAL DATA
D2PAK (Plastic)
E
L2
A
C2
L
L3
D
A1
B2
B
G
C
R
A2
M*
V2
* FLAT ZONE NO LESS THAN 2mm
FOOT PRINT (in millimeters)
16.90
BYW29/F/FP/G-200
REF.
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
DIMENSIONS
Millimeters
Inches
Min. Max. Min. Max.
4.40 4.60 0.173 0.181
2.49 2.69 0.098 0.106
0.03 0.23 0.001 0.009
0.70 0.93 0.027 0.037
1.14 1.70 0.045 0.067
0.45 0.60 0.017 0.024
1.23 1.36 0.048 0.054
8.95 9.35 0.352 0.368
10.00 10.40 0.393 0.409
4.88 5.28 0.192 0.208
15.00 15.85 0.590 0.624
1.27 1.40 0.050 0.055
1.40 1.75 0.055 0.069
2.40 3.20 0.094 0.126
0.40 typ.
0.016 typ.
0°
8°
0°
8°
10.30
8.90
5.08
1.30
3.70
5/7
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