TISP3080H3SL Просмотр технического описания (PDF) - Power Innovations Ltd
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TISP3080H3SL Datasheet PDF : 12 Pages
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TISP3070H3SL THRU TISP3095H3SL, TISP3125H3SL THRU TISP3210H3SL
TISP3250H3SL THRU TISP3350H3SL
DUAL BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
JANUARY 1999 - REVISED MAY 1999
SL003
MECHANICAL DATA
3-pin plastic single-in-line package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic com-
pound. The compound will withstand soldering temperature with no deformation, and circuit performance charac-
teristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or
processing when used in soldered assembly.
SL003
10,2 (0.400) MAX
4,57 (0.180)
MAX
Index
Dot
8,31 (0.327)
MAX
12,9 (0.492)
MAX
1
2
1,854 (0.073) MAX
0,711 (0.028)
0,559 (0.022)
3 Places
4,267 (0.168)
MIN
3
Pin Spacing
2,54 (0.100) T.P.
(see Note A)
2 Places
6,60 (0.260)
6,10 (0.240)
0,356 (0.014)
0,203 (0.008)
3 Places
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
NOTES: A. Each pin centerline is located within 0,25 (0.010) of its true longitudinal position.
B. Body molding flash of up to 0,15 (0.006) may occur in the package lead plane.
PRODUCT INFORMATION
MDXXAD
11
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