HMC324MS8G Просмотр технического описания (PDF) - Hittite Microwave
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HMC324MS8G Datasheet PDF : 6 Pages
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MICROWAVE CORPORATION
HMC324MS8G
HBT DUAL DRIVER AMPLIFIER DC - 3.0 GHz
FEBRUARY 2001
Evaluation PCB for HMC324MS8G
V00.1200
1
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the
ground plane similar to that shown above. A sufficient number of VIA holes should be used to connect the top
and bottom ground planes. The evaluation circuit board as shown is available from Hittite upon request.
Evaluation Circuit Board Layout Design Details
Item
J1 - J4
U1
PCB*
Description
PC Mount SMA Connector
HMC324MS8G
104221 Evaluation PCB 1.5" x 1.5"
*Circuit Board Material: Rogers 4350
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343
1 - 160
Fax: 978-250-3373
Web Site: www.hittite.com
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