SPF-3043 Просмотр технического описания (PDF) - Sirenza Microdevices => RFMD
Номер в каталоге
Компоненты Описание
производитель
SPF-3043 Datasheet PDF : 4 Pages
| |||
Caution: ESD sensitive
Appropriate precautions in handling, packaging and
testing devices must be observed.
Pin #
1
2
3
4
Pin Description
Function
Gate
Source
Drain
Source
Description
RF Input / Gate Bias
Connection to ground. Use via holes to reduce lead
inductance. Place vias as close to ground leads as possible.
RF Output / Drain Bias
Same as Pin 2
Pin Designation
4
3
Pending ObsolesPcreenlicmeinary
SPF-3043 Low Noise pHEMT GaAs FET
Part Number Ordering Information
Part Number
SPF-3043
Reel Size
7"
Devices/Reel
3000
Part Symbolization
The part will be symbolized with the “F3”
designator and a dot signifying pin 1 on the top
surface of the package.
Recommended PCB Layout
SOT-343
Package
1
2
Plated Thru
Holes
(0.020" DIA)
Ground
Plane
Use multiple plated-through vias holes located
close to the package pins to ensure a good RF
ground connection to a continuous groundplane
on the backside of the board.
D
e
e
HE CL
F3
CL
b
b1
Package Dimensions
L
E
Q1
C
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
A2
A
2. DIMENSIONS ARE INCLUSIVE OF PLATING.
3. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH
& METAL BURR.
4. ALL SPECIFICATIONS COMPLY TO EIAJ SC70.
A1
5. DIE IS FACING UP FOR MOLD AND FACING DOWN
FOR TRIM/FORM. ie :REVERSE TRIM/FORM.
6. PACKAGE SURFACE TO BE MIRROR FINISH.
SYMBOL
E
D
HE
A
A2
A1
Q1
e
b
b1
c
L
MIN
MAX
1.15
1.35
1.85
2.25
1.80
2.40
0.80
1.10
0.80
1.00
0.00
0.10
0.10
0.40
0.65 BSC
0.25
0.40
0.55
0.70
0.10
0.18
0.10
0.30
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
4
http://www.sirenza.com
EDS-101772 Rev D
Share Link: 